Qualcomm Dragonwing RB3 Gen 2 Development Kit

schematics

partial (96Boards mezzanine standard)

toolchain

open (open Qualcomm Linux + AI Hub)

datasheets

brief (public brief)

blobs

required (proprietary silicon + firmware)

retail

distributor (via Thundercomm/distributors)

form_factor

board (96Boards development-kit board)

Qualcomm publishes a product brief and an open Linux/Android SDK, including the BSD-3-Clause AI Hub Models repository, though that license does not cover its Hexagon tooling. The kit's own board files are not published; it only follows the 96Boards mezzanine interface standard.

• https://api.github.com/repos/quic/ai-hub-models recorded 2026-08-14

  Qualcomm AI Hub Models, license spdx_id BSD-3-Clause, 1183 stars, last pushed 2026-08-13 - the open half of the toolchain

• https://docs.edgeimpulse.com/hardware/boards/qualcomm-rb3-gen-2-dev-kit recorded 2026-08-14

  "Other QCS6490-based kits are available from various manufacturers such as Advantech, Tria, Thundercomm, and Quectel" - distributor rather than open-market availability

• https://docs.qualcomm.com/doc/87-74789-1/87-74789-1_REV_A_Qualcomm_RB3_Gen_2_Development_Kit_Product_Brief.pdf recorded 2026-08-14

  Qualcomm's own "Qualcomm RB3 Gen 2 Development Kit" product brief, 87-74789-1 Rev. A - "The hardware development kit is also compliant with the 96Boards open hardware specification to support a range of mezzanine-board expansions"; software "Support for Linux, Android", Qualcomm Intelligent Multimedia, Intelligent Robotics, Neural Processing and Hexagon SDKs; spec table Chipset QCS6490, Octa-core CPU, AI 12 TOPS

• https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit recorded 2026-06-22

  official page: QCS6490, up to 12 TOPS, 96Boards design, Qualcomm Linux stack. Not re-fetchable as a document - the URL returns 200 but the body is a ~9KB client-rendered shell with no product content in it, which no header set changes - so it keeps its recorded read

Edge Impulse fully supports the kit alongside its other Dragonwing boards, and other QCS6490 kits come from Advantech, Tria, Thundercomm and Quectel. That points to an established but specialist developer base rather than mass-market reach.

• https://docs.edgeimpulse.com/hardware/boards/qualcomm-rb3-gen-2-dev-kit recorded 2026-08-13

  "It's fully supported by Edge Impulse - you'll be able to sample raw data, build models", listed among the Qualcomm Dragonwing boards with an IM SDK GStreamer pipeline page

The QCS6490's Hexagon NPU delivers 12 TOPS, above the 6 TOPS RK3588 boards in this category and below the Jetson Orin NX.

• https://docs.edgeimpulse.com/hardware/boards/qualcomm-rb3-gen-2-dev-kit recorded 2026-09-29

  Edge Impulse board page: "It’s fully supported by Edge Impulse - you’ll be able to sample raw data" and the kit is "based around the QCS6490 SoC. It has two built-in cameras, a Kryo™ 670 CPU, Adreno™ 643L GPU and 12 TOPS Hexagon™ 770 NPU".

• https://www.qualcomm.com/developer/hardware/rb3-gen-2-development-kit recorded 2026-06-22

  up to 12 dense TOPS, QCS6490 SoC specs